Source: Master Bond Inc.
System EP51AO is a two component, ceramic filled, thermally conductive, electrically insulative epoxy resin compound
Master Bond Inc.AO is a two component, ceramic filled, thermally conductive, electrically insulative epoxy resin compound designed for heat dissipative bonding, sealing and potting assemblies. The compound has been formulated to cure at ambient temperatures with a one-to-one ration, weight or volume. The cured epoxy resin compound is said to exhibit high physical strength properties together with an thermal conductivity of 8 Btu/hr/ft²/°F/in. at 75°F. it is designed to be an electrical insulator with an electrical volume resistivity in excess of 1012
ohm cm. This resin gels in as little as five minutes, according to the company, and cures completely within two hours at ambient temperatures.
The product offers adhesion to both metallic and nonmetallic substrates. It is 100% reactive and does not emit volatiles during cure. The cured compound can be used over a temperature range of –65°F to +250°F. Excursions to temperatures up to 300°F or more are acceptable without incurring deleterious effects. Bonds, seals and pottings made with this resin are designed to withstand severe thermal and/or mechanical shocks and vibration. It can be used in temperature sensitive electronic and electronic assemblies requiring heat dissipation or heat sinking of thermally active components at or near ambient conditions.
<%=company%>, 154 Hobart St, Hackensack, NJ 07601-3922; phone: 201-343-8983; fax: 201-343-2132